Impact of Encapsulated Phase Change Material Additives For Improved Thermal Performance of Silicone Gel Insulation

2024-9-11

Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films

2024-8-24

Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes

2024-8-23

Development of a Thermal Metrology Standard for Evaluation of Cold Plate Thermal Resistance as a Performance Metric

2024-8-1

Thermal Property Estimation of Thin-Layered Structures by Means of Thermoreflectance Measurement and Network Identification by Deconvolution Algorithm

2024-8-1

Application of the Nonlinear Fracture Mechanics Parameter Δ<i>T</i>* to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures

2024-8-1

Process Recipe and Functional Circuitry Performance On Aerosol Jet Printed Water-Based Silver Ink

2024-7-20

Transient Liquid Phase Bond Acceleration Using Copper Nanowires

2024-7-20

Impact of Immersion Cooling On Thermomechanical Properties of Halogen-free Substrate Core

2024-7-20

Incorporating Tensile Stress into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints

2024-7-20

Virtual Testbed for Economical and Reliability Analysis of Battery Thermal Management Control Strategies

2024-7-18

Electrochemical Additive Manufacturing Based Design of a Heat Sink for Single Phase Natural Convection Immersion Cooling Application

2024-7-18

Multi-Physics Coupling in IGBT Modules: A Review

2024-7-17

Thermal Spreading Resistance of Near Surface Localized Heating-Induced Size Effects in Semiconductors

2024-7-17

L2A Cdus Performance and Considerations for Server Rooms Upgrade with Conventional Air Conditioning

2024-7-17

Cold Gas Spraying Copper Metal On AlN Ceramics as an Alternative to Thick DBC Substrates for Power Electronics

2024-7-17

Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers

2024-7-17

Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics

2024-7-17

Convection Cooling of Power Electronics Operating in Deep-Space

2024-7-17

Electrically Conductive Adhesives in Microelectronics Packaging

2024-7-15

Reliability Assessment and Multi-Physics Simulation of Additively Printed Wearable Humidity Sensor with Super Capacitive Material for Astronaut in Extreme Condition

2024-7-15

Thermal-Hydraulic Characterization of a Thermosyphon Cooling System for Highly Compact Edge Microdatacenter

2024-7-1

Investigation of the Impacts of Solder Alloy Composition and Temperature Profile On Fatigue Life of Bga Solder Joints Under Accelerated Thermal Cycling

2024-6-24

Co-Packaged Optics - Heterogeneous Integration of Photonic IC and Electronic IC

2024-6-4

A Review of Mechanism and Technology of Hybrid Bonding

2024-6-3

Acoustic Characterization of Integrated Circuits During Operation

2024-6-3

Performance Analysis of Liquid-to-Air Heat Exchanger of High-Power Density Racks

2024-5-17

Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multi-Chip Module

2024-5-6

High Gain Compact Antenna-in-Package Solution Using Like Mushroom Electromagnetic Band Gap for Industrial, Scientific, and Medical Band

2024-3-22

Correlation Study on Voiding in Underfill of Large Quantity Ball Grid Array Chip Using Machine Learning

2024-3-16

A Kriging Surrogate Model for Ball Grid Array Electronic Packaging With Stochastic Material and Geometrical Parameters

2024-3-16

Effect of Dispensing Type On Void Formation Using Convolutional Neural Network

2024-3-16

Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging

2024-3-11

Research Status and Progress on Non-Destructive Testing Methods for Defect Inspection of Micro-Electronic Packaging

2024-3-8

Hybrid Bonding for Ultra-High-Density Interconnect

2024-3-8

Constant Strain-Rate Garofalo Creep Behavior of Intermediate 83Pb/10Sb/5Sn/2Ag and 91.5Sn/8.5Sb Solder Materials

2024-2-12

Modeling the Thermal-Compression Flip-Chip Process by Finite Element Analysis

2024-2-9

Forward Kinematics Analysis of High-Precision Optoelectronic Packaging Platform

2024-2-9

Epoxy-Printed Circuit Board Interfacial Fracture Reliability Under Three-Point and Four-Point Bend Loading After Sustained Elevated Temperature Exposure

2024-2-1

A Comparative Numerical Analysis of Cold Plates for Thermal Management of Chips With Hotspots

2024-1-23

Interface Reliability Modeling of Coaxial Through Silicon Via Based on WOA-BP Neural Network

2024-1-23

Characterization of a Rack-Level Thermosyphon-Based Cooling System

2024-1-23

Effects of Thermal-Moisture Coupled Field On Delamination Behavior of Electronic Packaging

2023-12-21

Research Status and Progress on Non-Destructive Testing Methods for Defect Inspection of Micro-Electronic Packaging

2023-12-21

Simultaneous Characterization of Both Ctes and Thermal Warpages of Flip-Chip Packages with a Cap Using Strain Gauges

2023-12-21

The Research for Quickly Measuring the Diameter and Roundness of Solder Balls Based on Machine Vision Technology

2023-12-11

Numerical and Experimental Investigation of a Volumetric Resistance Blower Performance and Its Optimization for Portable Computing Device Applications

2023-12-11

A Comprehensive Study on Characterization of Residual Stress of Build-Up Layer and Prediction of Chip Warpage

2023-11-23

Optimal Design of Thermal Cycling Reliability for Plastic Ball Grid Array Assembly Via Finite Element Method and Taguchi Method

2023-11-20

Printed Circuit Board Defect Image Recognition Based on the Multimodel Fusion Algorithm

2023-11-20